DISA Technologies Raises $30 Million in Series A2 Financing Round Led by Evok Innovations and Constellation Technology Ventures

DISA Technologies closed an oversubscribed Series A2 financing round, securing $30 million in private capital with support from Evok Innovations and Constellation Technology Ventures. The funding will accelerate commercial deployment of the company's High-Pressure Slurry Ablation (HPSA) technology for mineral processing and environmental remediation.